Issued Patents 2024
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11916006 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff | 2024-02-27 |
| 11901330 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini, Arun Chandrasekhar | 2024-02-13 |
| 11894324 | In-package RF waveguides as high bandwidth chip-to-chip interconnects and methods for using the same | Aleksandar Aleksov, Telesphor Kamgaing, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Eyal Fayneh +2 more | 2024-02-06 |
| 11881457 | Semiconductor packaging with high density interconnects | Adel A. Elsherbini, Shawna M. Liff, Henning Braunisch, Krishna Bharath, Javier Soto Gonzalez +1 more | 2024-01-23 |
| 11876053 | Multi-chip package and method of providing die-to-die interconnects in same | Henning Braunisch, Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz +1 more | 2024-01-16 |