Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125734 | Vacuum seal for electrostatic chuck | — | 2024-10-22 |
| 12125728 | Substrate carrier | Fred Eric Ruhland, Sumit Subhash Patankar, Daniel Lee Diehl, Mingwei Zhu, Hiroyuki Takahama +1 more | 2024-10-22 |
| 12097665 | Porous plug bonding | — | 2024-09-24 |
| 12061103 | Packaging design for a flow sensor and methods of manufacturing thereof | Srikanth Krishnamurthy, Ming Xu, Ashley M. Okada, Ramachandra Murthy Gunturi | 2024-08-13 |
| 12057298 | Apparatus for fiber optic temperature probe in processing chambers | Marcus Blake Freitas, David Masayuki Ishikawa, Visweswaren Sivaramakrishnan | 2024-08-06 |
| 12033837 | Electrostatic chuck assembly for cryogenic applications | — | 2024-07-09 |
| 12020912 | Integrated electrode and ground plane for a substrate support | — | 2024-06-25 |
| 12009244 | Tunable temperature controlled substrate support assembly | Steven E. Babayan, Konstantin Makhratchev, Zhiqiang Guo, Phillip R. Sommer, Dan Marohl | 2024-06-11 |
| 11955361 | Electrostatic chuck with mesas | Ashutosh Agarwal | 2024-04-09 |
| 11948826 | High power electrostatic chuck design with radio frequency coupling | Jaeyong Cho, Haitao Wang, Kartik Ramaswamy, Chunlei Zhang | 2024-04-02 |
| 11881423 | Electrostatic chuck with metal bond | — | 2024-01-23 |