Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12165905 | Process kit enclosure system | Helder Lee, Nicholas Michael Kopec, Leon Volfovski, Douglas R. McAllister, Andreas Schmid +2 more | 2024-12-10 | $69,596,000 |
| 12094752 | Wafer edge ring lifting solution | Michael R. Rice, Yogananda Sarode Vishwanath, Sunil Srinivasan, Rajinder Dhindsa, Olivier Luere +2 more | 2024-09-17 | $46,375,000 |
| 12009244 | Tunable temperature controlled substrate support assembly | Vijay D. Parkhe, Konstantin Makhratchev, Zhiqiang Guo, Phillip R. Sommer, Dan Marohl | 2024-06-11 | $84,570,000 |
| 11887879 | In-situ apparatus for semiconductor process module | Yogananda Sarode Vishwanath, Stephen Prouty, Andreas Schmid | 2024-01-30 | $39,141,000 |