Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165905 | Process kit enclosure system | Helder Lee, Nicholas Michael Kopec, Leon Volfovski, Douglas R. McAllister, Andreas Schmid +2 more | 2024-12-10 |
| 12094752 | Wafer edge ring lifting solution | Michael R. Rice, Sunil Srinivasan, Rajinder Dhindsa, Steven E. Babayan, Olivier Luere +2 more | 2024-09-17 |
| 12002703 | Lift pin assembly | Anand KUMAR | 2024-06-04 |
| 11887879 | In-situ apparatus for semiconductor process module | Steven E. Babayan, Stephen Prouty, Andreas Schmid | 2024-01-30 |