Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176443 | Electronic sensor devices and methods of manufacturing electronic sensor devices | Sung Hwan Yang, Jae Ho Lee | 2024-12-24 |
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2024-10-01 |
| 12033946 | Semiconductor devices and methods of manufacturing semiconductor devices | Seung Chul Jang, Ron Huemoeller | 2024-07-09 |
| 12002725 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2024-06-04 |
| 11990435 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2024-05-21 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2024-04-16 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2024-02-20 |