Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12002725 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jin Seong Kim, Jae Sung Park | 2024-06-04 |
| 11961775 | Semiconductor devices and related methods | Gyu Wan Han, Won Bae Bang, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park +10 more | 2024-04-16 |