Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2024-10-01 |
| 12060477 | Polymer composition for manufacturing large container containing high-density polyethylene recovered from secondary battery separator and large container manufactured using the same | Hye Jin Lee, Jong-Sang Park | 2024-08-13 |
| 12057434 | Semiconductor package and manufacturing method thereof | Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone, Jae Ung Lee +2 more | 2024-08-06 |
| 12002725 | Sensor package and manufacturing method thereof | Ji Young Chung, Dong Joo Park, Jae Sung Park, Se Hwan Hong | 2024-06-04 |
| 11966549 | Touch display apparatus | Ju Han Kim, Yong Chan Park, Seung Kyeom Kim | 2024-04-23 |
| 11869829 | Semiconductor device with through-mold via | Dong Joo Park, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2024-01-09 |