Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Robert Lanzone, Jae Ung Lee +2 more | 2024-08-06 |
| 11976151 | Polymer polyol and process for producing the same | Seulgi KIM, Jinwoo Park | 2024-05-07 |