Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961797 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Chel Woo Park | 2024-04-16 |
| 11869829 | Semiconductor device with through-mold via | Dong Joo Park, Jin Seong Kim, Ki Wook Lee, Ho Choi, Kwang Ho Kim +3 more | 2024-01-09 |