Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961797 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang | 2024-04-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961797 | Semiconductor package and fabricating method thereof | Keun Soo Kim, Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang | 2024-04-16 |