Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12021005 | Semiconductor device including a thermal material | Yu Jin Jeon, Mi Kyoung Choi, Young Ik Kwon | 2024-06-25 |
| 11961797 | Semiconductor package and fabricating method thereof | Jae Yun Kim, Byoung Jun Ahn, Dong Soo Ryu, Dae Byoung Kang, Chel Woo Park | 2024-04-16 |