Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Byong Woo Cho +4 more | 2024-10-01 |
| 12002725 | Sensor package and manufacturing method thereof | Ji Young Chung, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2024-06-04 |
| 11996369 | Semiconductor devices and methods of manufacturing semiconductor devices | Myung Jea Choi, Gyu Wan Han, Gi Tae Lim, Ji Hun Yi, Jin Young Khim | 2024-05-28 |
| 11961775 | Semiconductor devices and related methods | Gyu Wan Han, Won Bae Bang, Ju-Hyung Lee, Min Hwa Chang, Jin Young Khim +10 more | 2024-04-16 |
| 11869829 | Semiconductor device with through-mold via | Jin Seong Kim, Ki Wook Lee, Dae Byoung Kang, Ho Choi, Kwang Ho Kim +3 more | 2024-01-09 |