Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Byong Jin Kim, Gi Jeong Kim, Jae Doo Kwon, Hyung Il Jeon | 2024-08-13 |
| 11961775 | Semiconductor devices and related methods | Gyu Wan Han, Ju-Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim +10 more | 2024-04-16 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Byong Jin Kim, Gi Jeong Kim, Ji Young Chung | 2024-04-16 |
| 11923280 | Semiconductor device and manufacturing method thereof | Kwang Seok Oh | 2024-03-05 |