Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131982 | Electronic package structure with reduced vertical stress regions | Tae Kyung Hwang, Eun Sook Sohn, Won Joon Kang | 2024-10-29 |
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Jae Doo Kwon, Hyung Il Jeon | 2024-08-13 |
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Jae Min Bae, Seung-Mo Kim +1 more | 2024-08-13 |
| 12057378 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Byong Jin Kim, Junichiro Abe | 2024-08-06 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Ji Young Chung | 2024-04-16 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Ji Young Chung | 2024-02-20 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Yong Ho Son, Byong Jin Kim, Jae Min Bae, Seung Woo Lee | 2024-01-30 |