Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087676 | Semiconductor devices having a plurality of offsets in leads supporting stacked components and methods of manufacturing thereof | Hyung Jun Cho, Seung Woo Lee | 2024-09-10 |
| 12062833 | Packaged electronic device having integrated antenna and locking structure | Marc Alan Mangrum, Hyung Jun Cho, Byong Jin Kim, Gi Jeong Kim, Seung-Mo Kim +1 more | 2024-08-13 |
| 11915998 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Kyoung Yeon Lee, Tae Yong Lee | 2024-02-27 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2024-02-20 |
| 11887916 | Semiconductor devices and methods of manufacturing semiconductor devices | Hyeong Il Jeon, Gi Jeong Kim, Yong Ho Son, Byong Jin Kim, Seung Woo Lee | 2024-01-30 |