Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046798 | Semiconductor devices and methods of manufacturing semiconductor devices | Corey Reichman, Se Man Oh, Byong Jin Kim | 2024-07-23 |
| 11967567 | Semiconductor package with EMI shield and fabricating method thereof | Doo Soub Shin, Tae Yong Lee, Sung Gyu Kim | 2024-04-23 |
| 11915998 | Semiconductor device and a method of manufacturing a semiconductor device | Hyung Jun Cho, Tae Yong Lee, Jae Min Bae | 2024-02-27 |
| 11908779 | Land structure for semiconductor package and method therefor | Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim, Ji Young Chung | 2024-02-20 |