Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967567 | Semiconductor package with EMI shield and fabricating method thereof | Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim | 2024-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11967567 | Semiconductor package with EMI shield and fabricating method thereof | Tae Yong Lee, Kyoung Yeon Lee, Sung Gyu Kim | 2024-04-23 |