Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131982 | Electronic package structure with reduced vertical stress regions | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131982 | Electronic package structure with reduced vertical stress regions | Tae Kyung Hwang, Eun Sook Sohn, Gi Jeong Kim | 2024-10-29 |