Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2024-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062588 | Semiconductor package having routable encapsulated conductive substrate and method | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim, Hyung Il Jeon | 2024-08-13 |