Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11785776 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Wenguang Shi, Guanping Wu, Baoyou Chen | 2023-10-10 |
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Si Ping Hu | 2023-08-01 |
| 11545505 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Wenguang Shi, Guanping Wu, Baoyou Chen | 2023-01-03 |