Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Si Ping Hu, Xianjin Wan | 2023-08-01 |
| 11556107 | Machining apparatus error correction system and method using safe, correction and alarm intervals | Neng-Wei Chang, Tao Zeng, Hai-Jiu Wan, Bing Zhou | 2023-01-17 |