Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791265 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2023-10-17 |
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Liang Ma, Yuan Li, Xianjin Wan | 2023-08-01 |
| 11670543 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2023-06-06 |