Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805646 | Three-dimensional memory devices and methods for forming the same | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-10-31 |
| 11791265 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2023-10-17 |
| 11699657 | Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-07-11 |
| 11670543 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2023-06-06 |