Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805646 | Three-dimensional memory devices and methods for forming the same | Jun Chen, Jifeng Zhu, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-10-31 |
| 11791265 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Si Ping Hu | 2023-10-17 |
| 11785776 | Through array contact structure of three-dimensional memory device | Wenguang Shi, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-10-10 |
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen, Guanping Wu +2 more | 2023-09-12 |
| 11699657 | Three-dimensional memory devices having a plurality of NAND strings located between a substrate and a single crystalline silicon layer | Jifeng Zhu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2023-07-11 |
| 11665893 | Methods and apparatuses having strings of memory cells including a metal source | Roger W. Lindsay, Andrew Bicksler, Yongjun Jeff Hu, Haitao Liu | 2023-05-30 |
| 11626424 | Semiconductor devices and methods of fabrication | Hongbin Zhu, Gordon A. Haller, Jie Sun, Randy J. Koval, John D. Hopkins | 2023-04-11 |
| 11609723 | Approach for providing access to cloud services on end-user devices using local management of third-party services | Jayasimha Nuggehalli, Bhushan Nadkarni, Srikrishna Narasimhan | 2023-03-21 |
| 11599586 | Method and system for providing alternative result for an online search previously with no result | Rongkai Zhao, Kenneth Katschke | 2023-03-07 |
| 11545505 | Through array contact structure of three-dimensional memory device | Wenguang Shi, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-01-03 |