Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11785776 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-10-10 |
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2023-09-12 |
| 11545505 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Guanping Wu, Xianjin Wan, Baoyou Chen | 2023-01-03 |