Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11785776 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Wenguang Shi, Xianjin Wan, Baoyou Chen | 2023-10-10 |
| 11758732 | Hybrid bonding contact structure of three-dimensional memory device | Zhenyu Lu, Simon Shi-Ning Yang, Feng Pan, Steve Weiyi Yang, Jun Chen +2 more | 2023-09-12 |
| 11728326 | Three-dimensional memory device and fabrication method thereof | Ziqi Chen, Chao Li | 2023-08-15 |
| 11545505 | Through array contact structure of three-dimensional memory device | Zhenyu Lu, Wenguang Shi, Xianjin Wan, Baoyou Chen | 2023-01-03 |