Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Yuan Li, Si Ping Hu, Xianjin Wan | 2023-08-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715718 | Bonding contacts having capping layer and method for forming the same | Jie Pan, Shu Liang Lv, Yuan Li, Si Ping Hu, Xianjin Wan | 2023-08-01 |