Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Wei-Chung Lo, Tao-Chih Chang, Yu-Min Lin, Sheng-Tsai Wu | 2023-12-26 |
| 11811145 | Antenna box module and antenna box | Tsai-Yi Yang, Yung-Sheng Tseng, Bo Yuan Chang, Sheng-Shen Chang, Shih-Shih Chien +1 more | 2023-11-07 |
| 11791256 | Package substrate and method of fabricating the same | Wei-Chung Lo, Dyi-Chung Hu, Chang-Hong Hsieh | 2023-10-17 |