Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Sheng-Tsai Wu | 2023-12-26 |
| 11775878 | Automated machine learning test system | Yan Gao, Joshua David Griffin, Bengt Wisen Pederson, Ricky Dee Tharrington, Jr., Pei-Yi Tan +1 more | 2023-10-03 |
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11635988 | Optimal number of threads determination system | Yan Gao, Joshua David Griffin, Yan Xu, Seyedalireza Yektamaram, Amod Anil Ankulkar +5 more | 2023-04-25 |
| 11630114 | Method for quantitative measurement of catechol estrogen bound protein in blood sample | Shu-Hui Chen, Yu Huang, Hung-Hsiang Jen | 2023-04-18 |
| 11587905 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2023-02-21 |
| 11569217 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| 11555653 | Vapor/liquid condensation system | Chih-Peng Chen | 2023-01-17 |