Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Tao-Chih Chang, Yu-Min Lin | 2023-12-26 |
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Yuan-Yin Lo, Tzu-Hsuan Ni +1 more | 2023-05-09 |
| 11587905 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Chao-Jung Chen, Tzu-Hsuan Ni, Shin-Yi Huang +1 more | 2023-02-21 |
| 11569217 | Image sensor package and manufacturing method thereof | Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Tzu-Hsuan Ni, Chao-Jung Chen +1 more | 2023-01-31 |
| D976852 | Power module | Hsin-Han Lin, Yuan-Yin Lo, Kuo-Shu Kao, Tai-Jyun Yu, Han-Lin Wu +1 more | 2023-01-31 |