Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776867 | Chip package | Kuo-Shu Kao, Tao-Chih Chang, Wen-Chih Chen, Po-Kai Chiu, Yen-Ting Lin +1 more | 2023-10-03 |
| D976852 | Power module | Sheng-Tsai Wu, Hsin-Han Lin, Yuan-Yin Lo, Kuo-Shu Kao, Han-Lin Wu +1 more | 2023-01-31 |