Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Wei-Chung Lo, Yu-Min Lin, Sheng-Tsai Wu | 2023-12-26 |
| 11776867 | Chip package | Kuo-Shu Kao, Wen-Chih Chen, Tai-Jyun Yu, Po-Kai Chiu, Yen-Ting Lin +1 more | 2023-10-03 |
| 11756858 | Power module with housing having bending sections | Wei Han, Chia-Yen Lee, Jing-Yao Chang | 2023-09-12 |