Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854961 | Package substrate and method of fabricating the same and chip package structure | Yu-Hua Chen, Tao-Chih Chang, Yu-Min Lin, Sheng-Tsai Wu | 2023-12-26 |
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Dyi-Chung Hu, Chang-Hong Hsieh | 2023-10-17 |