Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2023-10-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Dyi-Chung Hu | 2023-10-17 |