Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791256 | Package substrate and method of fabricating the same | Yu-Hua Chen, Wei-Chung Lo, Chang-Hong Hsieh | 2023-10-17 |
| 11567122 | Semiconductor device and manufacturing method thereof | — | 2023-01-31 |