Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646270 | Multi-chip package and manufacturing method thereof | Ang-Ying Lin, Yu-Min Lin, Shin-Yi Huang, Sheng-Tsai Wu, Yuan-Yin Lo +1 more | 2023-05-09 |
| 11587905 | Multi-chip package and manufacturing method thereof | Yu-Min Lin, Ang-Ying Lin, Sheng-Tsai Wu, Chao-Jung Chen, Shin-Yi Huang +1 more | 2023-02-21 |
| 11569217 | Image sensor package and manufacturing method thereof | Sheng-Tsai Wu, Yu-Min Lin, Yuan-Yin Lo, Ang-Ying Lin, Chao-Jung Chen +1 more | 2023-01-31 |