Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848208 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Chin-Yuan Tseng, Ru-Gun Liu | 2023-12-19 |
| 11796922 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Huicheng Chang, Chia-Cheng Chen, Jyu-Horng Shieh, Liang-Yin Chen +7 more | 2023-10-24 |
| 11791161 | Pattern fidelity enhancement | Yu-Tien Shen, Ya-Wen Yeh, Ya Hui Chang, Yung-Sung Yen, Wei-Hao Wu +3 more | 2023-10-17 |
| 11764068 | Method of manufacturing semiconductor devices | Ru-Gun Liu, Chih-Ming Lai, Yung-Sung Yen, Ken-Hsien Hsieh, Chin-Hsiang Lin | 2023-09-19 |
| 11651972 | Method of manufacturing semiconductor devices using directional process | Ya-Wen Yeh, Yu-Tien Shen, Shih-Chun Huang, Po-Chin Chang, Yung-Sung Yen +4 more | 2023-05-16 |
| 11641744 | Method for fabricating memory device | Wen-Jer Tsai | 2023-05-02 |
| 11616067 | Method of making semiconductor device which includes Fins | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng, Jiann-Tyng Tzeng +3 more | 2023-03-28 |
| 11569090 | Directional deposition for semiconductor fabrication | Shih-Chun Huang, Ya-Wen Yeh, Chien-Wen Lai, Ya Hui Chang, Yung-Sung Yen +3 more | 2023-01-31 |