Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848208 | Method for forming semiconductor device structure | Chih-Ming Lai, Shih-Ming Chang, Wei-Liang Lin, Ru-Gun Liu | 2023-12-19 |
| 11616067 | Method of making semiconductor device which includes Fins | Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio +3 more | 2023-03-28 |