Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837551 | Semiconductor package | Jongyoun Kim, Gwangjae Jeon | 2023-12-05 |
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Kyoung Lim Suk, Jaegwon Jang | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Kyoung Lim Suk, Jaegwon Jang, Gwangjae Jeon | 2023-10-31 |
| 11705341 | Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layers | Gwangjae Jeon | 2023-07-18 |
| 11694936 | Semiconductor package and method of fabricating the same | Minjung Kim, Kyoung Lim Suk | 2023-07-04 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Yeonho Jang, Jaegwon Jang | 2023-04-25 |
| 11626393 | Semiconductor package and method of fabricating the same | Kyoung Lim Suk | 2023-04-11 |
| 11626354 | Method of manufacturing redistribution substrate | — | 2023-04-11 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Yeonho Jang, Jaegwon Jang | 2023-03-28 |
| 11610785 | Semiconductor packages | Kyoung Lim Suk, Ae-Nee Jang, Jaegwon Jang | 2023-03-21 |
| 11605584 | Semiconductor package | Kyoung Lim Suk, Keung Beum Kim, Dongkyu Kim, Minjung Kim | 2023-03-14 |
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Minjun Bae | 2023-03-07 |