Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837551 | Semiconductor package | Seokhyun Lee, Gwangjae Jeon | 2023-12-05 |
| 11810849 | Connection structure and method of forming the same | — | 2023-11-07 |
| 11646260 | Semiconductor package and method of fabricating the same | Eungkyu Kim, Gwangjae Jeon | 2023-05-09 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jungho Park, Seokhyun Lee, Yeonho Jang, Jaegwon Jang | 2023-04-25 |
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Seokhyun Lee, Minjun Bae | 2023-03-07 |
| 11569157 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jungho Park, Jaegwon Jang | 2023-01-31 |