Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11600564 | Redistribution substrate, method of fabricating the same, and semiconductor package including the same | Jongyoun Kim, Seokhyun Lee | 2023-03-07 |
MB
Minjun Bae
Overall (2023): #328,923 of 537,848Top 65%
1
Patents 2023