Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Kyoung Lim Suk, Seokhyun Lee | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Gwangjae Jeon | 2023-10-31 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Yeonho Jang | 2023-04-25 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Yeonho Jang | 2023-03-28 |
| 11610785 | Semiconductor packages | Seokhyun Lee, Kyoung Lim Suk, Ae-Nee Jang | 2023-03-21 |
| 11569157 | Semiconductor package and method of manufacturing the same | Yeonho Jang, Jongyoun Kim, Jungho Park | 2023-01-31 |