Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810915 | Semiconductor package with redistribution substrate having embedded passive device | Seokhyun Lee, Jaegwon Jang | 2023-11-07 |
| 11804427 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang, Gwangjae Jeon | 2023-10-31 |
| 11694936 | Semiconductor package and method of fabricating the same | Minjung Kim, Seokhyun Lee | 2023-07-04 |
| 11626393 | Semiconductor package and method of fabricating the same | Seokhyun Lee | 2023-04-11 |
| 11610785 | Semiconductor packages | Seokhyun Lee, Ae-Nee Jang, Jaegwon Jang | 2023-03-21 |
| 11605584 | Semiconductor package | Keung Beum Kim, Dongkyu Kim, Minjung Kim, Seokhyun Lee | 2023-03-14 |