Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837551 | Semiconductor package | Jongyoun Kim, Seokhyun Lee | 2023-12-05 |
| 11804427 | Semiconductor package | Dongkyu Kim, Seokhyun Lee, Kyoung Lim Suk, Jaegwon Jang | 2023-10-31 |
| 11791295 | Semiconductor package with thick under-bump terminal | Dongkyu Kim, Jung-Ho Park, Yeonho Jang | 2023-10-17 |
| 11705341 | Method of fabricating a semiconductor package having redistribution patterns including seed patterns and seed layers | Seokhyun Lee | 2023-07-18 |
| 11646260 | Semiconductor package and method of fabricating the same | Jongyoun Kim, Eungkyu Kim | 2023-05-09 |