Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791295 | Semiconductor package with thick under-bump terminal | Gwangjae Jeon, Dongkyu Kim, Jung-Ho Park | 2023-10-17 |
| 11637081 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Seokhyun Lee, Jaegwon Jang | 2023-04-25 |
| 11616051 | Semiconductor package device | Dongkyu Kim, Seokhyun Lee, Jaegwon Jang | 2023-03-28 |
| 11569157 | Semiconductor package and method of manufacturing the same | Jongyoun Kim, Jungho Park, Jaegwon Jang | 2023-01-31 |