Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830852 | Multi-tier backside power delivery network for dense gate-on-gate 3D logic | Lars Liebmann, Jeffrey Smith, Daniel Chanemougame, Paul Gutwin, Brian Tracy Cline +1 more | 2023-11-28 |
| 11726116 | Method and apparatus for on-chip power metering using automated selection of signal power proxies | Zhiyao Xie, Shidhartha Das | 2023-08-15 |
| 11650341 | Method and system for analyzing seismic active field based on expansion of empirical orthogonal function | Heqing Ma, Mingzhi Yang, Guofu Luo, Xiaojun Ma, Xianwei Zeng +3 more | 2023-05-16 |
| 11569219 | TSV coupled integrated circuits and methods | Rahul Mathur, Andy Wangkun Chen, Mudit Bhargava, Brian Tracy Cline, Saurabh Sinha | 2023-01-31 |