Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854930 | Semiconductor chip package and fabrication method thereof | Yi-Lin Tsai, Yi-Jou Lin, I-Hsuan Peng | 2023-12-26 |
| 11854784 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin, Shih-Chin Lin | 2023-12-26 |
| 11837552 | Semiconductor package with layer structures, antenna layer and electronic component | Tao Cheng, Nan-Cheng Chen, Che-Ya Chou, Wen-Chou Wu, Yen-Ju Lu +2 more | 2023-12-05 |
| 11830851 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin | 2023-11-28 |
| 11791266 | Chip scale package structure and method of forming the same | Yen-Yao Chi, Nai-Wei Liu, Ta-Jen Yu, Tzu-Hung Lin | 2023-10-17 |
| 11742564 | Fan-out package structure with integrated antenna | Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin | 2023-08-29 |
| 11670596 | Semiconductor package structure | Yi-Lin Tsai, I-Hsuan Peng, Yi-Jou Lin | 2023-06-06 |
| 11652273 | Innovative air gap for antenna fan out package | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2023-05-16 |
| 11574881 | Semiconductor package structure with antenna | Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin | 2023-02-07 |