Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824041 | Hyperchip | Mark Bohr, Wilfred Gomes, Rajesh Kumar, Doug B. Ingerly | 2023-11-21 |
| 11822249 | Method and apparatus to develop lithographically defined high aspect ratio interconnects | — | 2023-11-21 |
| 11817423 | Double-sided substrate with cavities for direct die-to-die interconnect | — | 2023-11-14 |
| 11774489 | Multi-member test probe structure | Justin Huttula | 2023-10-03 |
| 11756860 | Semiconductor device stack-up with bulk substrate material to mitigate hot spots | Shrenik Kothari, Chandra Mohan Jha, Weihua Tang, Robert L. Sankman, Xavier Francois Brun | 2023-09-12 |
| 11639556 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Joe Walczyk, Andrew Hoitink, Tanner Schulz | 2023-05-02 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Weihua Tang, Chandra Mohan Jha, Zhimin Wan | 2023-04-11 |
| 11622466 | Low force liquid metal interconnect solutions | Karumbu Meyyappan, Kyle Arrington, David Craig | 2023-04-04 |
| 11581237 | Cooling apparatuses for microelectronic assemblies | Joe Walczyk | 2023-02-14 |
| 11543454 | Double-beam test probe | Paul Diglio, Karumbu Meyyappan | 2023-01-03 |