Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837458 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi | 2023-12-05 |
| 11798894 | Devices and methods for signal integrity protection technique | Jackson Chung Peng Kong, Khang Choong Yong, Kooi Chi Ooi, Min Suet Lim | 2023-10-24 |
| 11758662 | Three dimensional foldable substrate with vertical side interface | Tin Poay Chuah, Jackson Chung Peng Kong | 2023-09-12 |
| 11676910 | Embedded reference layers for semiconductor package substrates | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2023-06-13 |
| 11652026 | Micro through-silicon via for transistor density scaling | Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2023-05-16 |
| 11639623 | Micro-hinge for an electronic device | Howe Yin Loo, Min Suet Lim, Jackson Chung Peng Kong, Poh Tat Oh | 2023-05-02 |
| 11574877 | Semiconductor miniaturization through component placement on stepped stiffener | Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong | 2023-02-07 |
| 11562963 | Stacked semiconductor package and method of forming the same | Chin Lee Kuan, Jackson Chung Peng Kong, Sameer Shekhar, Amit Jain | 2023-01-24 |
| 11562954 | Frame-array interconnects for integrated-circuit packages | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2023-01-24 |
| 11557552 | 3D trench reference planes for integrated-circuit die packages | Chin Lee Kuan, Jackson Chung Peng Kong | 2023-01-17 |
| 11545434 | Vertical die-to-die interconnects bridge | Yang Liang Poh, Kooi Chi Ooi | 2023-01-03 |