Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837458 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi | 2023-12-05 |
| 11798894 | Devices and methods for signal integrity protection technique | Bok Eng Cheah, Jackson Chung Peng Kong, Khang Choong Yong, Min Suet Lim | 2023-10-24 |
| 11710029 | Methods and apparatus to improve data training of a machine learning model using a field programmable gate array | Min Suet Lim, Denica N. Larsen, Lady Nataly Pinilla Pico, Divya Vijayaraghavan | 2023-07-25 |
| 11676910 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2023-06-13 |
| 11586473 | Methods and apparatus for allocating a workload to an accelerator using machine learning | Divya Vijayaraghavan, Denica N. Larsen, Lady Nataly Pinilla Pico, Min Suet Lim | 2023-02-21 |
| 11584368 | Evaluating risk factors of proposed vehicle maneuvers using external and internal data | Naissa Conde, Casey Baron, Shekoufeh Qawami, Mengjie Yu | 2023-02-21 |
| 11545434 | Vertical die-to-die interconnects bridge | Bok Eng Cheah, Yang Liang Poh | 2023-01-03 |